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詳細(xì)內(nèi)容:PC DE004ERP,PC DF002 金龍先生15916816001 洽談Q Q:1362174071 PC DE004ERP,PC DF002 DC0049XF Electrically Conductive, , Flame Retardant Polycarbonate compound containing Flame Retardant, Carbon Fiber.導(dǎo)電、阻燃聚碳酸酯復(fù)合含阻燃、碳纖維。 DC006ER Easy Molding Polycarbonate compound containing Carbon Fiber.容易成型聚碳酸酯復(fù)合含炭纖維。 DC006H Electrically Conductive Polycarbonate compound containing Carbon Fiber.導(dǎo)電聚碳酸酯復(fù)合含炭纖維。 DE004ERP Electrically Conductive, Easy Molding, Mold Release Polycarbonate compound containing Carbon Fiber.導(dǎo)電,容易成型、脫模聚碳酸酯復(fù)合含炭纖維。 DF002 Polycarbonate compound containing Glass Fiber.聚碳酸酯復(fù)合含有玻璃纖維。 PC DE004ERP,PC DF002 SD1278 PC Copolymer, Heat Stabilized, High Impact, PC共聚物、熱穩(wěn)定、耐沖擊、 SLX1231T Low viscosity PC Copolymer blend, enhanced UV stabilization, mold release added. 低粘度PC共聚物混合、增強(qiáng)的紫外線穩(wěn)定、脫模補(bǔ)充道. SLX1431D Medium viscosity, PC Copolymer blend, enhanced UV stabilization, mold release added. 介質(zhì)粘度、PC共聚物混合、增強(qiáng)的紫外線穩(wěn)定、脫模補(bǔ)充道. SLX1432 Medium visocisty PC Copolymer, enhanced UV stabilization, mold release added. 中等visocisty PC共聚物、增強(qiáng)的紫外線穩(wěn)定、脫模補(bǔ)充道. SLX1432T Medium viscosity PC Copolymer, enhanced UV stabilization, mold release added. 介質(zhì)粘度PC共聚物、增強(qiáng)的紫外線穩(wěn)定、脫模補(bǔ)充道. SLX2231T Low viscosity PC Copolymer blend, enhanced UV stabilization, mold release added. 低粘度PC共聚物混合、增強(qiáng)的紫外線穩(wěn)定、脫模補(bǔ)充道. PC DE004ERP,PC DF002 我司主要經(jīng)營(yíng)品牌有日本住友、大金、寶理、帝人、旭化成、東麗、 出光、美國(guó)杜邦、德國(guó)拜耳(朗盛)、美國(guó)SABIC(GE),LNP,RTP,DOW,TICONA,德國(guó)巴斯夫、赫斯特,荷蘭DSM,瑞士EMS ,山都平TPV等 售后服務(wù): 本公司品種齊全,貨源充足,產(chǎn)品原廠原包,質(zhì)量保證,價(jià)格優(yōu)惠,以上原料均提供物性表、UL黃卡、SGS、 本公司具一般納稅人資格,可開(kāi)17%增值稅 本公司的宗旨:以和為貴,以誠(chéng)為信,以信譽(yù)迎客戶,以客戶求發(fā)展。以迎各地客戶來(lái)電、來(lái)函訂購(gòu)!
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